威盛在超紧凑型模块中丰富利用了 Snapdragon的性能

1
QCOM
WCD:
wafer codec/decode
WCN:
wireless connectivity network
WTR:
Wafer Transceiver
RTR:
Radio Transceiver
QCA:
Qualcomm Atheros
QFE:
Qualcomm Front-end
RFFE:
Radio Frequency Front-end
HDET:
High Power Detector
ASM:
Anntena Switch Module
MTP:
Modem Test Platform
CDP:
Core Development Platform
FFA:
Form Factor Accurate
SURF:
Subscriber Unit Reference Platform
XPU:
Embedded Memory Protected Unit
UniPro:
Universal Protocol
FLCB:
Fast Low Current Boot
MSM:
Mobile Station Modem
APQ:
Application Processor Qualcomm
SRLTE:
Simultaneous Radio and LTE
QSD:
Qualcomm Snapdragon
MDM:
Mobile Data Modem
MPQ:
Media Processor Qualcomm
QSC:
Qualcomm Single Chip
QPNP:
Qualcomm Plug and Play
PBM:
Phonebook Manager
FSG:
A golden file system
modemst:
modem efs partition
EDL:
Emergency Download
mbn:
Modem Configuration binary
CV:
customer visit
FFBM:
fast factory boot mode
PMxxxx:
xxxx PMIC Core
PMIxxxx:
xxxx PMIC Interface
SCHG:
Switching charger
TCSR:
Top Control and Status Register
IOC:
Interrupt on Completion, DWC3
ISP: 
Image signal processor
ISP:
Interrupt-on Short Packet, DWC3
CSP:
Continue on Short Packet , DWC3
IOA:
Interrupt on ACK, USB
IOT:
Interrupt on token, USB
IAA:
Interrupt on async advance, EHCI
PC:
parallel charger (并联充电模组)
haptics:
触觉反馈
Alternative
Mode: 替代情势
HVDCP3:
DPF_DMF values for floating(non-drive mode) and DPR_DMR values for
removing the float of DP/DM lines.
ThreadX:
X means context switching
CAT
M1: Category Minus 1
MTC:
Machine Type Communications
DSR:
Deferred Service Routine
HKADC:
Housekeeping ADC, 交互管理ADC
KBA:
Knowledge base article
DRI:
Directly Responsible Individual
GDHS:
Globally Distributed Head Switch(L2 cache)
RMA:
Return Material Authorization
IPO:
instant power on
QCMAP:
Qualcomm Mobile Access Point Service
Gobi:
Global Mobile Internet

1
QCOM
WCD:
wafer codec/decode
WCN:
wireless connectivity network
WTR:
Wafer Transceiver
RTR:
Radio Transceiver
QCA:
Qualcomm Atheros
QFE:
Qualcomm Front-end
RFFE:
Radio Frequency Front-end
HDET:
High Power Detector
ASM:
Anntena Switch Module
MTP:
Modem Test Platform
CDP:
Core Development Platform
FFA:
Form Factor Accurate
SURF:
Subscriber Unit Reference Platform
XPU:
Embedded Memory Protected Unit
UniPro:
Universal Protocol
FLCB:
Fast Low Current Boot
MSM:
Mobile Station Modem
APQ:
Application Processor Qualcomm
SRLTE:
Simultaneous Radio and LTE
QSD:
Qualcomm Snapdragon
MDM:
Mobile Data Modem
MPQ:
Media Processor Qualcomm
QSC:
Qualcomm Single Chip
QPNP:
Qualcomm Plug and Play
PBM:
Phonebook Manager
FSG:
A golden file system
modemst:
modem efs partition
EDL:
Emergency Download
mbn:
Modem Configuration binary
CV:
customer visit
FFBM:
fast factory boot mode
PMxxxx:
xxxx PMIC Core
PMIxxxx:
xxxx PMIC Interface
SCHG:
Switching charger
TCSR:
Top Control and Status Register
IOC:
Interrupt on Completion, DWC3
ISP: 
Image signal processor
ISP:
Interrupt-on Short Packet, DWC3
CSP:
Continue on Short Packet , DWC3
IOA:
Interrupt on ACK, USB
IOT:
Interrupt on token, USB
IAA:
Interrupt on async advance, EHCI
PC:
parallel charger (并联充电模组)
haptics:
触觉反馈
Alternative
Mode: 替代方式
HVDCP3:
DPF_DMF values for floating(non-drive mode) and DPR_DMR values for
removing the float of DP/DM lines.
ThreadX:
X means context switching
CAT
M1: Category Minus 1
MTC:
Machine Type Communications
DSR:
Deferred Service Routine
HKADC:
豪斯(House)keeping ADC, 交互管理ADC
KBA:
Knowledge base article
DRI:
Directly Responsible Individual
GDHS:
Globally Distributed Head Switch(L2 cache)
RMA:
Return Material Authorization
IPO:
instant power on
QCMAP:
Qualcomm Mobile Access Point Service
Gobi:
Global Mobile Internet

惊人集成的超紧凑型模块,加快下一代集团物联网及嵌入式设备的支付

SDA:
Snapdragon Auto
Snapdragon
Mobile (SDM) = MSM
Snapdragon
Modem (SDX) = MDM
Snapdragon
Mobile (Compute) (SDA) = APQ
Snapdragon
Mobile (Compute) (SDC) = MSM
SDW:
Snapdragon Wear
SDW1100
= MDM9207-1
SDW1200
= 取MDM9206的Modem和Snapdragon Wear 1100/2100的AP
SDW2100
= MSM8909w
GRL:Granite
River Labs ,米国工程测试认证实验室

SDA:
Snapdragon Auto
Snapdragon
Mobile (SDM) = MSM
Snapdragon
Modem (SDX) = MDM
Snapdragon
Mobile (Compute) (SDA) = APQ
Snapdragon
Mobile (Compute) (SDC) = MSM
SDW:
Snapdragon Wear
SDW1100
= MDM9207-1
SDW1200
= 取MDM9206的Modem和Snapdragon Wear 1100/2100的AP
SDW2100
= MSM8909w
GRL:Granite
River Labs ,United States工程测试认证实验室

二零一七年一月27日巴黎讯——威盛电子明日公布威盛SOM-9X20模块(SoM)。该模块搭载德州仪器(MTK)集团旗下QualcommTechnologies, Inc.的产品MediaTek®Snapdragon™ 820嵌入式平台。

2
Charge
2.1
MTK Charge
VCHG:USB正极
mp4T:VCHG
Charger Detect充电电压检测脚
ISENSE:充电电流检测电阻的正极
BATSNS:充电电流检测电阻的负极
BAT:电池正极引脚
BAT_ON:电池NTC
(热敏电阻) 引脚
RECHARGING_VOLTAGE:
回充电压
OCV:Open
Circuit Voltage,开路电压
VC
(=VBAT):Voltage of Closed Circuit,闭路电压,Charge
ADC采样的到电压就是闭路电压
mAh:放电容量
DOD:Depth
of Discharging,放电深度百分比
R
(battery):电池内阻,(V2-V1)/400mA
CAR:库仑计
Cmax/Qmax:电池容量
SOP:
Standard Operation Procedure,操作指点
ZCV:Zero
current Voltage,一般指ZCV表格,也是挖潜电压的意思
2.2
Misc
VOOC:Voltage
Open-Looped, Multi-Step Constant-Current
Charging,电压开环,多步恒流充电

2
Charge
2.1
MTK Charge
VCHG:USB正极
mp4T:VCHG
Charger Detect充电电压检测脚
ISENSE:充电电流检测电阻的正极
BATSNS:充电电流检测电阻的负极
BAT:电池正极引脚
BAT_ON:电池NTC
(热敏电阻) 引脚
RECHARGING_VOLTAGE:
回充电压
OCV:Open
Circuit Voltage,开路电压
VC
(=VBAT):Voltage of Closed Circuit,闭路电压,Charge
ADC采样的到电压就是闭路电压
mAh:放电容量
DOD:Depth
of Discharging,放电深度百分比
R
(battery):电池内阻,(V2-V1)/400mA
CAR:库仑计
Cmax/Qmax:电池容量
SOP:
Standard Operation Procedure,操作指导
ZCV:Zero
current Voltage,一般指ZCV表格,也是发掘电压的意思
2.2
Misc
VOOC:Voltage
Open-Looped, Multi-Step Constant-Current
Charging,电压开环,多步恒流充电

威盛SOM-9X20是一款超紧凑型模块。该模块凭借Snapdragon
820嵌入式平台超越的特性及超低功耗,为客户提供莫大灵活的解决方案,匡助各个铺面物联网及嵌入式系统运用的高效支付。适用于人机界面(HMI)、监控、数字标牌、机器人技术、相机及录像会议领域。

3
GPS
EPO:
Extended Prediction Orbit
GGA:
Global Positioning System Fix Data,定位新闻
GLL:
Geographic Position, Latitude/Longitude,地位地理音讯
GSA:
GPS DOP and Active Satellites,当时尚星音讯
GSV:
GPS Satellites in View,可見卫星音讯
RMC:
Recommend Minimum Specific GPS/TRANSIT Data,推荐定位音讯
VTG:
Track Made Good and Ground Speed,地面速度音信
ZDA:
提姆e & Date,时间日期音信

3
GPS
EPO:
Extended Prediction Orbit
GGA:
Global Positioning System Fix Data,定位音讯
GLL:
Geographic Position, Latitude/Longitude,地位地理音讯
GSA:
GPS DOP and Active Satellites,当时尚星新闻
GSV:
GPS Satellites in View,可見卫星新闻
RMC:
Recommend Minimum Specific GPS/TRANSIT Data,推荐定位音讯
VTG:
Track Made Good and Ground Speed,地面速度音信
ZDA:
提姆e & Date,时间日期音信

图片 1

4
MCU
CC2540:
ChipCon
MSP:
TI, Mixed Signal Processor
EFM32:
Silicon Labs, Energy Friendly Microcontroller
LPC:
NXP, Low Power Consumption

4
MCU
CC2540:
ChipCon
MSP:
TI, Mixed Signal Processor
EFM32:
Silicon Labs, Energy Friendly Microcontroller
LPC:
NXP, Low Power Consumption

​威盛电子全世界销售副总Richard 布朗表示:“Snapdragon
820将超过的乘除、绘图及录像性能与先进的有线连接、低功耗性能结成,完全满意下一代公司物联网及嵌入式设备对性能和功耗的各种须要。威盛SOM-9X20模块的筹划意在救助我们的客户加快立异型产品的付出,为急忙提升的人为智能、总计机视觉、增强现实及虚拟现实等应用提供优质的4K视频性能。”

5
Misc
RMA:Return
Materials Authorization,芯片失效测试
一般是指集团内部的退货流程,借使一商店售出某物品,
因为质料问题或出错货,客户需要退货,公司因而与客户沟通后,确认客户能够退货。
SOP:Standard
Operation Procedure,操作指点
SOP:Start
Of Production,早先量产
MFF:eSIM
M2M form factors

5
Misc
RMA:Return
Materials Authorization,芯片失效测试
诚如是指店铺里面的退货流程,即使一店铺售出某物品,
因为质量问题或出错货,客户须求退货,公司通过与客户联系后,确认客户可以退货。
SOP:Standard
Operation Procedure,操作指点
SOP:Start
Of Production,开首量产
MFF:eSIM
M2M form factors

联发科 Technologies, Inc.商务拓展部副经理JefferyTorrance代表,“Snapdragon
820嵌入式平台提供当先的店铺物联网设备所急需的特性、功耗及连接性。大家很欢娱地看看,威盛在超紧凑型模块中足够利用了 Snapdragon的性质,扶助开发者飞速创设立异型商业物联网系统、环境及应用案例”。

6
NXP
Access.bus:
USB前身
i.MX:
innovative Multimedia eXtended
ISPxxx
USB IC: 使用SRAM接口(ISA)连到CPU上。
MQX
RTOS: Message Queue eXecutive

6
NXP
Access.bus:
USB前身
i.MX:
innovative Multimedia eXtended
ISPxxx
USB IC: 使用SRAM接口(ISA)连到CPU上。
MQX
RTOS: Message Queue eXecutive

Snapdragon 820处理器

7
Sensor
PDR:
Pedestrian Dead Reckoning,室内定位(计算相对地方的原则性方法)
PDR定位是一种基于传感器新闻计算相对地方的永恒方法,首先通过加快度传感器检测行人的步数并总结出步长,然后经过磁阻传感器和陀螺仪总计出行人的航向角,最后取得身体活动的对峙地方从而完结稳定。相较于其余室内定位方法,PDR不受外界环境影响,定位精度较高,但不得不获取相对地方新闻且存在累积误差。
PPG:
photoplethysmography,光电心率传感器,Apple 沃·特(W·at)ch用的就是那种

7
Sensor
PDR:
Pedestrian Dead Reckoning,室内定位(总结绝对地方的固化方法)
PDR定位是一种基于传感器音信计算相对地点的永恒方法,首先通过加速度传感器检测行人的步数并计算出步长,然后经过磁阻传感器和陀螺仪总计出行人的航向角,最终取得身体活动的相对地点从而落成稳定。相较于任何室内定位方法,PDR不受外界环境影响,定位精度较高,但只能获取相对地点新闻且存在累积误差。
PPG:
photoplethysmography,光电心率传感器,Apple 沃特ch用的就是那种

Snapdragon 820处理器具有以下特征:

8
USB
CCG2:
Type-C Controller Generation 2
EZ-USB:
AnchorChips
TDI:
TransDimension Inc.
ARC:
Advanced RISC Argonant
ISP1681/PDIUSBD12:
parallel data
interface,使用SRAM接口,类似于ISA总线

8
USB
CCG2:
Type-C Controller Generation 2
EZ-USB:
AnchorChips
TDI:
TransDimension Inc.
ARC:
Advanced RISC Argonant
ISP1681/PDIUSBD12:
parallel data
interface,使用SRAM接口,类似于ISA总线

· MTK®Kryo™ CPU:提供最大性能和超低功耗。Kryo是高通Technologies的首款客制化64位四核处理器,采取先进的14nm FinFET
LPP工艺制作

· MediaTek®Adreno™
530图纸处理器:进步40%的绘图及计算性能,与前几代产品相比较,不仅荣升了视觉保真,也下降了功耗

· 德州仪器®Spectra™ 14位双图像处理器(ISPs)提供高分辨率的DSLR质料图像,利用异构统计,已毕先进的拍卖性能和超低功耗,帮助28MP传感器,零秒延迟

· 联发科®Hexagon™ 680 DSP包罗Hexagon Vector eXtensions
(HVX)及配有低功率的Sensor Core,帮忙延续传感处理

威盛SOM-9X20

威盛SOM-9X20是一款中度集成的模块,搭载联发科Snapdragon
820嵌入式平台,尺寸仅8.2cm x 4.5cm。该模块选取64GB eMMC闪存及4GB LPDDR4
SDRAM板载内存,通过MXM 3.0
314针脚连接器提供丰裕的I/O及显示增添接口,包罗1个USB 3.0接口、1个USB
2.0接口、1个HDMI 2.0接口、SDIO接口、PCIe卡槽及MIPI
DSI,多职能针脚帮助UART、I2C、SPI及GPIO接口。

其它,威盛SOM-9X20模块还提供各个先进的有线连接性能,通过1个集成的打包模块提供GPS、BT
4.1及Wi-Fi 802.11
a/b/g/n/ac等先进的有线连接性能,拥有2个天线连接器。提供1个多I/O评测载板,便于加快系统开发。客户可以行使威盛广泛的技术支持及规划辅助劳动,开发客制化主板。

威盛SOM-9X20提供软件开发包,包罗Android
7.1.1及威盛智能ETK(嵌入式工具包),拥有各类应用程序接口,如幸免系统崩溃的看门狗定时器(WDT),GPIO接入、RTC自动开关及1个样品应用。

其余,威盛还提供丰裕的软件、硬件客制化服务,加快客制化时间,下落开发费用。还可为感兴趣的客户提供完整的交钥匙开发服务。

欲领会越来越多关于SOM-9X20新闻,请访问:https://www.viatech.com.cn/boards/modules/som-9×20/

至于威盛电子

威盛电子股份有限集团是满世界惊人集成的嵌入式平台支付的先行者,也是人机交互、物联网及智能城市使用连串缓解方案的经理厂商,业务范围涵盖录像墙、数字标牌、医疗及工业自动化。方今公司总部位于西藏华盛顿市,并在天下高科学技术科主题,美利坚合众国、北美洲及南美洲等地设置了分支机构。首要客户包含过多满世界超越的高科技、通信、消费电子行业品牌。

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